Application
IC (SOT、SOP、DIP、BGA、QFN、DFN、COB CALSS)
Advantages
◆ Fully enclosed copper wire N? protection, anti oxidation, low gas consumption
◆ XY Table High resolution 0.1 μ M ± 3 μ M bonding accuracy
◆ ATC Kit to Maintain Long Loop Stability (Optional)
◆ Capable of bonding 2.5mil copper wire
◆ High resolution EFO
◆ Full closed-loop force control
◆ Rapid & convenient for products exchanging
Specification parameters
