Lingbo Weibu  Semiconductor showcased the company's latest products and solutions at the SEMICON CHINA 2023 event, welcoming partners from all walks of life around the world.

The Lingbo Weibu  new generation ball welding machine T9 adopts the new XYZ platform, which is suitable for lead frame widths of up to 100mm. Currently, a small batch of prototypes are being smoothly developed at the customer's DEMO, and the upgraded QUARK838 PLUS can be applied to packaging forms with higher quality requirements.

We are committed to providing customers with cost-effective products and services. As the first domestic manufacturer to launch IC ball welding machines on a scale of 100 units in the market, we will continue to strive tirelessly to contribute to the localization of semiconductor equipment.

Looking forward to connecting with you!